Shanghai Yogel Communication Equipment Co., Ltd.

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Fiber Arrays for High-End Chip Manufacturing Double Cladding 2D Arrays with PM Fiber

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Shanghai Yogel Communication Equipment Co., Ltd.
City:shanghai
Province/State:shanghai
Country/Region:china
Contact Person:MrRoger
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Fiber Arrays for High-End Chip Manufacturing Double Cladding 2D Arrays with PM Fiber

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Brand Name :YOGEL
Certification :ISO9000
Place of Origin :CHINA
MOQ :1
Price :negotiate
Payment Terms :L/C, D/A, T/T, Western Union, MoneyGram
Supply Ability :100 pieces per month
Packaging Details :Carton box
Substrate Material :Quartz,BF33 and others
Fiber Spacing(um) :127 or 250 or customized
Fiber Core Position Tolerance(um) :≤1.0,or customized
Polishing Angle(°) :0°~45°,or customized
Fiber Type :SM,PM
Number of Channels :Up to 128CH,or customized
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Fiber Arrays for High-End Chip Manufacturing Double Cladding 2D Arrays with PM Fiber
Due to the use of high-end chip manufacturing technology, our company's fiber array products are not limited by the thickness and arrangement shape of the fiber. The thinnest fiber can reach 25um. The arrangement shape can be the traditional straight line; it can also be square, circular; it can even be parabolic, M-shaped, and random. The products cover one-dimensional linear arrays, two-dimensional surface arrays, and three-dimensional spherical fiber arrays.

The products can be used under harsh conditions such as high pressure, high vacuum, high temperature, and ultra-low temperature. They have good environmental adaptability and are widely used in communications, measurement, imaging, printing, welding and other fields.

Feature:

  • Fiber type (specify size, material): 40/48/55, quartz
  • NA:0.22
  • Single fiber attenuation:≦1 dB/m
  • Number of fibers:271
  • Device length: 3m (split beam length 0.5m)
  • Arrangement: Hexagonal Dense Pile Array
  • Duty Cycle:52%
  • Split strategy:1:7
  • Closed End Connector: Standard SMA905
  • Split-end connector.:Standard SMA905
  • Closed end face size: hexagonal with side length 0.459mm
  • Split bundle end face dimensions: 6 pcs φ0.385; 1pcs φ0.05
  • Channel Yield:≥99%
  • Yield rate of channels within 4 circles of the center: 100%

Application:

*Silicon photonics field

*PIC coupling application

*Grating coupling applications

*High-efficiency coupling of small mode spot laser chips

*Non-dimmable high-efficiency coupling

*Resistant to reflow soldering applications

*High power applications

Items Specs
Substrate Material Quartz,BF33 and others
Fiber Spacing(um) 127 or250 or customized
Fiber Core Position Tolerance(um) ≤1.0,or customized
Polishing Angle(°) 0°~45°,or customized
Fiber Type SM,PM
Number of Channels Up to 128CH,or customized
Operating temperature() -5~70

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